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In 2022, the revenue generated from accounting services hit an all-time high of 119.48 billion USD (“Accounting Services in the US - Market Size”, 2022). On top of this, research has shown that 45% of all accounting professionals would like to automate something about their workflow (Thomas, 2020). Indeed, a

In 2022, the revenue generated from accounting services hit an all-time high of 119.48 billion USD (“Accounting Services in the US - Market Size”, 2022). On top of this, research has shown that 45% of all accounting professionals would like to automate something about their workflow (Thomas, 2020). Indeed, a lot of bookkeeping accountancy has been phased out by simple automation. However, larger accounting tasks like business mergers still require a team of accountants despite being a largely iterative process. This project chronicles one such attempt at automating accounting events or transactions that are performed by businesses both large and small. With the help of accounting students Madeline Stolper and Heddie Liu we were able to build a fully-functioning website to automate accounting transactions. For this project, we used industry-standard software frameworks React and Express to build the site with dynamic accounting applications. These applications were built with reusable components, making the development of future applications very simple. We also leveraged cutting-edge technological solutions from Amazon Web Services to make the website available on the Internet with rapid response times. Lastly, we incorporated an agile approach to project management and communication, in order to create functionality in the most efficient and organized manner possible. On a large scale, something like this has never been attempted and TurboIFRS/GAAP represents a revolutionary leap in accounting automation.
ContributorsForde, Jakob (Author) / Roth, Ryder (Co-author) / McLemore, Benjamin (Co-author) / Chen, Yinong (Thesis director) / Hunt, Neil (Committee member) / Barrett, The Honors College (Contributor) / Computer Science and Engineering Program (Contributor) / School of Music, Dance and Theatre (Contributor) / School of Mathematical and Statistical Sciences (Contributor)
Created2022-05
Description
Spatial audio can be especially useful for directing human attention. However, delivering spatial audio through speakers, rather than headphones that deliver audio directly to the ears, produces the issue of crosstalk, where sounds from each of the two speakers reach the opposite ear, inhibiting the spatialized effect. A research team

Spatial audio can be especially useful for directing human attention. However, delivering spatial audio through speakers, rather than headphones that deliver audio directly to the ears, produces the issue of crosstalk, where sounds from each of the two speakers reach the opposite ear, inhibiting the spatialized effect. A research team at Meteor Studio has developed an algorithm called Xblock that solves this issue using a crosstalk cancellation technique. This thesis project expands upon the existing Xblock IoT system by providing a way to test the accuracy of the directionality of sounds generated with spatial audio. More specifically, the objective is to determine whether the usage of Xblock with smart speakers can provide generalized audio localization, which refers to the ability to detect a general direction of where a sound might be coming from. This project also expands upon the existing Xblock technique to integrate voice commands, where users can verbalize the name of a lost item using the phrase, “Find [item]”, and the IoT system will use spatial audio to guide them to it.
ContributorsSong, Lucy (Author) / LiKamWa, Robert (Thesis director) / Berisha, Visar (Committee member) / Barrett, The Honors College (Contributor) / Computer Science and Engineering Program (Contributor)
Created2022-05
Description
The areas of cloud computing and web services have grown rapidly in recent years, resulting in software that is more interconnected and and widely used than ever before. As a result of this proliferation, there needs to be a way to assess the quality of these web services in order

The areas of cloud computing and web services have grown rapidly in recent years, resulting in software that is more interconnected and and widely used than ever before. As a result of this proliferation, there needs to be a way to assess the quality of these web services in order to ensure their reliability and accuracy. This project explores different ways in which services can be tested and evaluated through the design of various testing techniques and their implementations in a web application, which can be used by students or developers to test their web services.
ContributorsHilliker, Mark Paul (Author) / Chen, Yinong (Thesis director) / Nakamura, Mutsumi (Committee member) / Computer Science and Engineering Program (Contributor) / School of Mathematical and Statistical Sciences (Contributor) / Barrett, The Honors College (Contributor)
Created2016-05
Description
Fracture phenomena have been extensively studied in the last several decades. Continuum mechanics-based approaches, such as finite element methods and extended finite element methods, are widely used for fracture simulation. One well-known issue of these approaches is the stress singularity resulted from the spatial discontinuity at the crack tip/front. The

Fracture phenomena have been extensively studied in the last several decades. Continuum mechanics-based approaches, such as finite element methods and extended finite element methods, are widely used for fracture simulation. One well-known issue of these approaches is the stress singularity resulted from the spatial discontinuity at the crack tip/front. The requirement of guiding criteria for various cracking behaviors, such as initiation, propagation, and branching, also poses some challenges. Comparing to the continuum based formulation, the discrete approaches, such as lattice spring method, discrete element method, and peridynamics, have certain advantages when modeling various fracture problems due to their intrinsic characteristics in modeling discontinuities.

A novel, alternative, and systematic framework based on a nonlocal lattice particle model is proposed in this study. The uniqueness of the proposed model is the inclusion of both pair-wise local and multi-body nonlocal potentials in the formulation. First, the basic ideas of the proposed framework for 2D isotropic solid are presented. Derivations for triangular and square lattice structure are discussed in detail. Both mechanical deformation and fracture process are simulated and model verification and validation are performed with existing analytical solutions and experimental observations. Following this, the extension to general 3D isotropic solids based on the proposed local and nonlocal potentials is given. Three cubic lattice structures are discussed in detail. Failure predictions using the 3D simulation are compared with experimental testing results and very good agreement is observed. Next, a lattice rotation scheme is proposed to account for the material orientation in modeling anisotropic solids. The consistency and difference compared to the classical material tangent stiffness transformation method are discussed in detail. The implicit and explicit solution methods for the proposed lattice particle model are also discussed. Finally, some conclusions and discussions based on the current study are drawn at the end.
ContributorsChen, Hailong (Author) / Liu, Yongming (Thesis advisor) / Jiao, Yang (Committee member) / Mignolet, Marc (Committee member) / Oswald, Jay (Committee member) / Solanki, Kiran (Committee member) / Arizona State University (Publisher)
Created2015
Description
For decades, microelectronics manufacturing has been concerned with failures related to electromigration phenomena in conductors experiencing high current densities. The influence of interconnect microstructure on device failures related to electromigration in BGA and flip chip solder interconnects has become a significant interest with reduced individual solder interconnect volumes. A survey

For decades, microelectronics manufacturing has been concerned with failures related to electromigration phenomena in conductors experiencing high current densities. The influence of interconnect microstructure on device failures related to electromigration in BGA and flip chip solder interconnects has become a significant interest with reduced individual solder interconnect volumes. A survey indicates that x-ray computed micro-tomography (µXCT) is an emerging, novel means for characterizing the microstructures' role in governing electromigration failures. This work details the design and construction of a lab-scale µXCT system to characterize electromigration in the Sn-0.7Cu lead-free solder system by leveraging in situ imaging.

In order to enhance the attenuation contrast observed in multi-phase material systems, a modeling approach has been developed to predict settings for the controllable imaging parameters which yield relatively high detection rates over the range of x-ray energies for which maximum attenuation contrast is expected in the polychromatic x-ray imaging system. In order to develop this predictive tool, a model has been constructed for the Bremsstrahlung spectrum of an x-ray tube, and calculations for the detector's efficiency over the relevant range of x-ray energies have been made, and the product of emitted and detected spectra has been used to calculate the effective x-ray imaging spectrum. An approach has also been established for filtering `zinger' noise in x-ray radiographs, which has proven problematic at high x-ray energies used for solder imaging. The performance of this filter has been compared with a known existing method and the results indicate a significant increase in the accuracy of zinger filtered radiographs.

The obtained results indicate the conception of a powerful means for the study of failure causing processes in solder systems used as interconnects in microelectronic packaging devices. These results include the volumetric quantification of parameters which are indicative of both electromigration tolerance of solders and the dominant mechanisms for atomic migration in response to current stressing. This work is aimed to further the community's understanding of failure-causing electromigration processes in industrially relevant material systems for microelectronic interconnect applications and to advance the capability of available characterization techniques for their interrogation.
ContributorsMertens, James Charles Edwin (Author) / Chawla, Nikhilesh (Thesis advisor) / Alford, Terry (Committee member) / Jiao, Yang (Committee member) / Neithalath, Narayanan (Committee member) / Arizona State University (Publisher)
Created2015
Description
In this dissertation, the results of our comprehensive computational studies of disordered jammed (i.e., mechanically stable) packings of hard particles are presented, including the family of superdisks in 2D and ellipsoids in 3D Euclidean space. Following a very brief introduction to the hard-particle systems, the event driven molecular dynamics (EDMD)

In this dissertation, the results of our comprehensive computational studies of disordered jammed (i.e., mechanically stable) packings of hard particles are presented, including the family of superdisks in 2D and ellipsoids in 3D Euclidean space. Following a very brief introduction to the hard-particle systems, the event driven molecular dynamics (EDMD) employed to generate the packing ensembles will be discussed. A large number of 2D packing configurations of superdisks are subsequently analyzed, through which a relatively accurate theoretical scheme for packing-fraction prediction based on local particle contact configurations is proposed and validated via additional numerical simulations. Moreover, the studies on binary ellipsoid packing in 3D are briefly discussed and the effects of different geometrical parameters on the final packing fraction are analyzed.
ContributorsXu, Yaopengxiao (Author) / Jiao, Yang (Thesis advisor) / Oswald, Jay (Committee member) / Liu, Yongming (Committee member) / Arizona State University (Publisher)
Created2014
Description
Machine learning has quickly become an ever-popular term and growing field in the area of computation. With each passing day, we see advancements of this field with natural language models, speech recognition, pattern recognition, computer vision, and many more. This progress is all in a quest to one day, meet

Machine learning has quickly become an ever-popular term and growing field in the area of computation. With each passing day, we see advancements of this field with natural language models, speech recognition, pattern recognition, computer vision, and many more. This progress is all in a quest to one day, meet or exceed the limits of humans in these areas. While visual-based detectors have seen an exciting level of growth and progress with large community projects, there currently exists a significant smaller community effort in the realm of audio-based emotional detectors. This seems to be a road worth exploring, as audio-based emotion detectors can complement the more popular facial-based detection systems by providing other contextual cues or information that may not be available to a visual-based detector. For example, a system utilizing audio has the benefit of being able to utilize an array of indirect emotional cues, such as tone or vocal sentence analysis, which a visual-based system would not capture since it is not capable of detecting these cues. A system using audio-based emotional detection would be incredibly important in instances where people partake in conversations among groups throughout a venue, such as when waiting for a flight in an airport. This system can be useful for environments demanding high accuracy recognition systems with multiple levels of confirmation, as a multimodal system consisting of two detectors, one facial and one audible, can provide a stronger prediction of emotion by complimenting on another. As such, I propose the following question that this research project will explore: how can an audio-based emotional detection augment facial emotion detection and how can such an audio-based system be designed in a low-cost and accurate manner?
ContributorsRoss, James (Author, Co-author) / Berisha, Visar (Thesis director) / Lubold, Nichola (Committee member) / Barrett, The Honors College (Contributor) / Computer Science and Engineering Program (Contributor)
Created2024-12
Description
Granular materials demonstrate complexity in many physical attributes with various shapes and sizes, varying from several centimeters down to less than a few microns. Some materials are highly cohesive, while others are free-flowing. Despite such complexity in their physical properties, they are extremely important in industries dealing with bulk materials.

Granular materials demonstrate complexity in many physical attributes with various shapes and sizes, varying from several centimeters down to less than a few microns. Some materials are highly cohesive, while others are free-flowing. Despite such complexity in their physical properties, they are extremely important in industries dealing with bulk materials. Through this research, the factors affecting flowability of particulate solids and their interaction with projectiles were explored. In Part I, a novel set of characterization tools to relate various granular material properties to their flow behavior in confined and unconfined environments was investigated. Through this work, a thorough characterization study to examine the effects of particle size, particle size distribution, and moisture on bulk powder flowability were proposed. Additionally, a mathematical model to predict the flow function coefficient (FFC) was developed, based on the surface mean diameter and moisture level, which can serve as a flowability descriptor. Part II of this research focuses on the impact dynamics of low velocity projectiles on granular media. Interaction of granular media with external foreign bodies occurs in everyday events like a human footprint on the beach. Several studies involving numerical and experimental methods have focused on the study of impact dynamics in both dry and wet granular media. However, most of the studies involving impact dynamics considered spherical projectiles under different conditions, while practical models should involve more complex, realistic shapes. Different impacting geometries with conserved density, volume, and velocity on a granular bed may experience contrasting drag forces upon penetration. This is due to the difference in the surface areas coming into contact with the granular media. In this study, a set of non-spherical geometries comprising cuboids, cylinders, hexagonal prisms and triangular prisms with constant density, volume, and impact velocities, were released onto a loosely packed, non-cohesive, dry granular bed. From these experimental results, a model to determine the penetration depth of projectiles upon impact was developed and how it is influenced by the release height and surface area of the projectiles in contact with the granular media was studied.
ContributorsVajrala, Spandana (Author) / Emady, Heather N (Thesis advisor) / Marvi, Hamidreza (Committee member) / Jiao, Yang (Committee member) / Arizona State University (Publisher)
Created2021
Description
Increasing density of microelectronic packages, results in an increase in thermal and mechanical stresses within the various layers of the package. To accommodate the high-performance demands, the materials used in the electronic package would also require improvement. Specifically, the damage that often occurs in solders that function as die-attachment and

Increasing density of microelectronic packages, results in an increase in thermal and mechanical stresses within the various layers of the package. To accommodate the high-performance demands, the materials used in the electronic package would also require improvement. Specifically, the damage that often occurs in solders that function as die-attachment and thermal interfaces need to be addressed. This work evaluates and characterizes thermo-mechanical damage in two material systems – Electroplated Tin and Sintered Nano-Silver solder.

Tin plated electrical contacts are prone to formation of single crystalline tin whiskers which can cause short circuiting. A mechanistic model of their formation, evolution and microstructural influence is still not fully understood. In this work, growth of mechanically induced tin whiskers/hillocks is studied using in situ Nano-indentation and Electron Backscatter Diffraction (EBSD). Electroplated tin was indented and monitored in vacuum to study growth of hillocks without the influence of atmosphere. Thermal aging was done to study the effect of intermetallic compounds. Grain orientation of the hillocks and the plastically deformed region surrounding the indent was studied using Focused Ion Beam (FIB) lift-out technique. In addition, micropillars were milled on the surface of electroplated Sn using FIB to evaluate the yield strength and its relation to Sn grain size.

High operating temperature power electronics use wide band-gap semiconductor devices (Silicon Carbide/Gallium Nitride). The operating temperature of these devices can exceed 250oC, preventing use of traditional Sn-solders as Thermal Interface materials (TIM). At high temperature, the thermomechanical stresses can severely degrade the reliability and life of the device. In this light, new non-destructive approach is needed to understand the damage mechanism when subjected to reliability tests such as thermal cycling. In this work, sintered nano-Silver was identified as a promising high temperature TIM. Sintered nano-Silver samples were fabricated and their shear strength was evaluated. Thermal cycling tests were conducted and damage evolution was characterized using a lab scale 3D X-ray system to periodically assess changes in the microstructure such as cracks, voids, and porosity in the TIM layer. The evolution of microstructure and the effect of cycling temperature during thermal cycling are discussed.
ContributorsLujan Regalado, Irene (Author) / Chawla, Nikhilesh (Thesis advisor) / Frear, Darrel (Committee member) / Rajagopalan, Jagannathan (Committee member) / Jiao, Yang (Committee member) / Arizona State University (Publisher)
Created2018
Description
Improved knowledge connecting the chemistry, structure, and properties of polymers is necessary to develop advanced materials in a materials-by-design approach. Molecular dynamics (MD) simulations can provide tremendous insight into how the fine details of chemistry, molecular architecture, and microstructure affect many physical properties; however, they face well-known restrictions in their

Improved knowledge connecting the chemistry, structure, and properties of polymers is necessary to develop advanced materials in a materials-by-design approach. Molecular dynamics (MD) simulations can provide tremendous insight into how the fine details of chemistry, molecular architecture, and microstructure affect many physical properties; however, they face well-known restrictions in their applicable temporal and spatial scales. These limitations have motivated the development of computationally-efficient, coarse-grained methods to investigate how microstructural details affect thermophysical properties. In this dissertation, I summarize my research work in structure-based coarse-graining methods to establish the link between molecular-scale structure and macroscopic properties of two different polymers. Systematically coarse-grained models were developed to study the viscoelastic stress response of polyurea, a copolymer that segregates into rigid and viscous phases, at time scales characteristic of blast and impact loading. With the application of appropriate scaling parameters, the coarse-grained models can predict viscoelastic properties with a speed up of 5-6 orders of magnitude relative to the atomistic MD models. Coarse-grained models of polyethylene were also created to investigate the thermomechanical material response under shock loading. As structure-based coarse-grained methods are generally not transferable to states different from which they were calibrated at, their applicability for modeling non-equilibrium processes such as shock and impact is highly limited. To address this problem, a new model is developed that incorporates many-body interactions and is calibrated across a range of different thermodynamic states using a least square minimization scheme. The new model is validated by comparing shock Hugoniot properties with atomistic and experimental data for polyethylene. Lastly, a high fidelity coarse-grained model of polyethylene was constructed that reproduces the joint-probability distributions of structural variables such as the distributions of bond lengths and bond angles between sequential coarse-grained sites along polymer chains. This new model accurately represents the structure of both the amorphous and crystal phases of polyethylene and enabling investigation of how polymer processing such as cold-drawing and bulk crystallization affect material structure at significantly larger time and length scales than traditional molecular simulations.
ContributorsAgrawal, Vipin (Author) / Oswald, Jay (Thesis advisor) / Peralta, Pedro (Committee member) / Chamberlin, Ralph (Committee member) / Solanki, Kiran (Committee member) / Jiao, Yang (Committee member) / Arizona State University (Publisher)
Created2016